Woburn, Mass., Dec. 14, 2021– The Chomerics division of Parker Hannifin Corporation, the global leader in motion and control technologies, today announced the launch of THERM-A-GAP™ PAD 30 and THERM-A-GAP™ PAD 60, the next-generation of thermally conductive gap filler pads from Parker Chomerics.
With performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD 60 offers the enticing combination of both excellent thermal conductivity at 6.0 W/m-K, while being more than 40% softer than current like-performance thermal gap pads from Parker Chomerics.
“Thermal gap filler pads continue to be designed and used in greater capacities for both price-sensitive markets, as well as those requiring high-performance materials,” said Brian Mahoney, thermal business unit manager, Chomerics Division. “We’re thrilled to expand our already impressive family of thermal gap filler pads with these next-generation offerings.”
Parker’s new thermal materials are manufactured globally and available in standard sheet sizes and thicknesses. They can easily be die-cut to custom dimensions and have various carrier and adhesive options for ease of use.
Learn more about the new THERM-A-GAP products at www.parker.com/chomerics.
Chomerics is a division of Parker Hannifin Corporation and is part of the Engineered Materials Group. It is the global leader in the development and application of electrically and thermally conductive materials in electronics, transportation and alternative energy systems. For details, please visit www.parker.com/chomerics.
About Parker Hannifin
Parker Hannifin is a Fortune 250 global leader in motion and control technologies. For 100 years, the company has engineered the success of its customers in a wide range of diversified industrial and aerospace markets. Learn more at www.parker.com or @parkerhannifin.